Date:2023-10-19

Semiconductor material is a type of electronic material that has semiconductor properties (conductivity is between conductors and insulators, resistivity is approximately in the range of 1mQ·cm~1GQ·cm) and can be used to make semiconductor devices and integrated circuits.   Substances and materials in nature can be divided into three categories: conductors, semiconductors and insulators a...

Date:2023-10-16

Signal amplifier is an important electronic device widely used in electronics, communications, audio and other fields. It can amplify weak signals to a strength suitable for processing, transmitting or driving other devices. Signal amplifiers have many important applications and advantages. Below I will introduce in detail the functions and advantages of signal amplifiers and their specific applic...

Date:2023-10-09

Packaging of electronic components refers to the process of physically protecting and connecting chips and other electronic components. It plays multiple functions such as insulation, mechanical support, heat dissipation, and electrical connection. Encapsulation not only protects electronic components from the external environment, but also facilitates the assembly and use of circuit boards. Packa...

Date:2023-10-07

  The differential amplifier circuit is a common amplifier circuit with the following 10 main functions.   The main function of the differential amplifier circuit is to amplify the differential mode signal in the input signal. The differential mode signal refers to the voltage difference between the non-inverting end and the inverting end of the input signal. By increasing the...

Date:2023-09-27

An operational amplifier (Op-Amp for short) is an electronic amplifier with the characteristics of high gain, high input impedance and low output impedance. It is widely used in analog circuits and signal processing fields. This article will explain in detail how op amps work. Basic structure An operational amplifier consists of a differential amplifier, a cascade amplifier and an output stage. ...

Date:2023-09-25

Thin film resistors and chip resistors are both commonly used types of resistors in electronic components, and they are widely used in circuits. Although both are resistors, their structures, manufacturing processes, and performance characteristics are different. This article will introduce in detail the difference between thin film resistors and chip resistors.   Thin film resistor Thin f...

Date:2023-09-20

A microcontroller chip is an integrated circuit (IC) that contains functions such as a microprocessor core, memory, input/output interfaces, and other auxiliary circuits. It is commonly used to control and manage the operation of various electronic devices or systems. What to do if the microcontroller chip is broken Confirm the fault phenomenon: First, you need to confirm whether the microco...

Date:2023-09-19

IC chips are an indispensable core component in modern electronic technology, but they are not immune to damage. Damage to the IC chip may cause various malfunctions. If you are interested in what is about to be covered, please continue reading below. I hope it will be helpful to you.   Abnormal function: After the IC chip is damaged, the most common problem is that its function is abnormal...

Date:2023-09-12

Packaging of electronic components refers to the process of physically protecting and connecting chips and other electronic components. It plays multiple functions such as insulation, mechanical support, heat dissipation, and electrical connection. Encapsulation not only protects electronic components from the external environment, but also facilitates the assembly and use of circuit boards. Packa...

Date:2023-09-11

MCM packaging is a microelectronic packaging technology, which stands for Multichip Module. MCM packaging is designed to integrate multiple integrated circuit chips (chips) into a single package to achieve higher integration and performance. Traditional single chip packages usually only contain one integrated circuit chip, which limits integration and functionality. However, as technology advance...

Date:2023-09-06

A sensor is a detection device that can sense the measured information and convert the sensed information into electrical signals or other required forms of information output according to certain rules to meet the requirements of information transmission, processing, storage, and display , recording and control requirements. This website has introduced many types of sensors. This article will ex...

Date:2023-09-04

A signal amplifier is a device used to enhance electronic signals. In the field of electronics, signal amplifiers are often used to extract weak signals from sensors or other electronic devices and amplify them into a measurable or processable range. Therefore, signal amplifiers play a very important role in many applications. This article will introduce in detail how to connect the signal amplifi...

Date:2023-08-31

I believe that many people are already familiar with the name sensor. Sensors are also used in all walks of life and even in our daily life. Whether it is aerospace or our home appliances, many sensors are used. So, do you know what are the classifications of sensors Let’s find out below.   Hall sensor: converts a changing magnetic field into a change in output voltage. The Hall sensor is...

Date:2023-08-28

SMD capacitors are a kind of component that we have more contact with. For this product, many people have such a question: Is the SMD capacitor divided into positive and negative poles The method of distinguishing the positive and negative poles of capacitors. Are chip capacitors divided into positive and negative poles Chip capacitors have positive and negative poles. It is a commonly used ca...

Date:2023-08-23

A microcontroller chip is an integrated circuit (IC) that contains functions such as a microprocessor core, memory, input/output interfaces, and other auxiliary circuits. It is commonly used to control and manage the operation of various electronic devices or systems. What to do if the microcontroller chip is broken？ Confirm the fault phenomenon: First, you need to confirm whether the microco...

Date:2023-08-21

As an important power management device in electronic equipment, the power IC chip undertakes various functions such as conversion, voltage regulation, and protection. However, in practical applications, the heating problem of the power IC chip is often concerned. This article will introduce in detail the reasons why the power IC chip heats up. Causes of power supply IC heating 1. The working te...

Date:2023-08-18

The sound sensor is an electronic device that can be used to detect and measure the sound of the surrounding environment. It usually consists of a microphone and an amplifier circuit and can convert the detected sound into an electrical signal. The sound sensor is often used for various purposes, such as Audio recording, noise monitoring, speech recognition, etc. The above is a preliminary introdu...

Date:2023-08-16

CSP (Chip Scale Package) packaging is a chip packaging technology, and its package size is quite close to the chip size, making the entire package volume very small. The design goal of CSP packaging is to realize highly integrated, high-performance and small-sized electronic devices.          In a CSP package, the chip is directly attached to the package substrate without...

Date:2023-08-14

DSO (Dual Small Outline) package is a package type of integrated circuit chip. It is a low-cost, miniaturized package that is widely used in various electronic devices and systems. DSO packaging is usually used to package medium-sized integrated circuit chips, such as microcontrollers, logic chips, memory chips, etc. It adopts a dual-column pinout design, and the pin count is usually between 8 an...

Date:2023-08-08

As an important power management device in electronic equipment, the power IC chip undertakes various functions such as conversion, voltage regulation, and protection. However, in practical applications, the heating problem of the power IC chip is often concerned. This article will introduce in detail the reasons for the heating of the power IC chip. Causes of power supply IC heating 1. The work...

Date:2023-08-07

SOT package refers to the abbreviation of "Small Outline Transistor", which is a form of integrated circuit packaging. SOT package is a surface mount technology (Surface Mount Technology, SMT) package, commonly used in small semiconductor devices, such as transistors, diodes and integrated circuits. The small size and lightweight profile of the SOT package make it suitable for space-constrained e...

Date:2023-08-01

A comparator is an electronic component or circuit used to compare an input signal with a reference signal. It compares an incoming signal to determine whether it is equal to a reference signal or exceeds a predetermined threshold. Comparators are widely used in electronic systems, such as analog circuits, digital circuits, computer processors and measuring instruments. There are many different...

Date:2023-07-31

There are also many types of chips. According to their uses and functions, they can be divided into storage chips, power chips, audio chips, interface chips, graphics chips, radio frequency chips, etc. There is also a chip called an ordinary chip. So what is the difference between RF chips and ordinary chips The difference between RF chips and ordinary chips is mainly in the operating temperat...

Date:2023-07-27

High-end chips refer to chip products that are at the leading level in the industry in terms of technology, performance, and power consumption. Internationally, there is no strict definition and unified statement on high-end chips. It is generally believed that it generally refers to a qualitative leap on the basis of ordinary chips, that is, higher integration, lower power consumption, and better...

Date:2023-07-25

LGA (Land Grid Array) is an integrated circuit packaging technology used to connect chips and motherboards. It is a form of Surface Mount Technology (SMT), widely used in the packaging of computer processors, chipsets and other high-performance integrated circuits The LGA package is different from the traditional PGA package. In the PGA package, the pins of the chip are connected by pins inserted...

Date:2023-07-21

DSo (Dual Small Outline) package is a package type of integrated circuit chip. It is a low-cost, miniaturized package that is widely used in various electronic devices and systems. DSO packaging is usually used to package medium-sized integrated circuit chips, such as microcontrollers, logic chips, memory chips, etc. It adopts a dual-column pinout design, and the pin count is usually between 8 an...

Date:2023-07-18

MCM packaging is a microelectronic packaging technology that stands for Multichip Module. MCM packaging is designed to integrate multiple integrated circuit chips (chips) into a single package to achieve higher integration and performance.   A traditional single chip package (Single Chip Package) usually contains only one integrated circuit chip, which limits the degree of integration and f...

Date:2023-07-11

  TQFP is the abbreviation of "Thin Quad Flat Pack", which means "thin four-sided flat package", and adopts straight-pin (gul-wing) pin design. It is one of the standard package types commonly used in integrated circuit packaging. The TQFP package features flat leads on four edges instead of two edges like traditional DIP packages. The pin layout of this package makes the TQFP package suitabl...

Date:2023-07-05

LGA (Land Grid Array) is an integrated circuit packaging technology used to connect the interface between the chip and the motherboard. It is a form of Surface Mount Technology (SMT), widely used in the packaging of computer processors, chipsets and other high-performance integrated circuits.  The LGA package is different from the traditional PGA package. In the PGA package, the pins of the ...

Date:2023-07-04

PGA is the abbreviation of "Pin Grid Array", which means "Pin Grid Array". PGA packaging is an electronic component packaging technology, commonly used in the packaging of integrated circuits (IC) and processors. In the PGA package, the pins are located in The bottom of the chip forms a regular grid-like arrangement for connection with the base or socket. In the PGA package, the pins of the chip ...