Chip packaging refers to connecting the circuit pins on the silicon chip to external wiring with wires in order to facilitate connection with other components. The packaging form refers to the shell used to install the semiconductor integrated circuit chip. Packaging a chip can play many roles, not only to install, fix, seal, and protect the chip, but also to connect the internal chip to the external circuit. However, when packaging the chip, it must be kept isolated from the outside world. This can effectively prevent impurities in the air from corroding the chip circuit and causing a decrease in electrical performance.

After packaging the chip, it will be easier to install and transport, because the quality of the chip technology will directly affect the performance of the chip itself and the design and manufacturing of the printed circuit board, so chip packaging technology is very important. If you want to know whether chip packaging technology is advanced, you can look at the ratio of chip area to packaging area. If this ratio is closer to 1, it means the chip packaging technology is more advanced.

There are also many types of chip packaging methods. According to the overall size and structure of the package, it can be divided into pin insertion type, surface mount type and advanced packaging. If classified according to the packaging material of the chip, it can be divided into metal packaging, ceramic packaging, plastic packaging and metal-ceramic packaging. In addition, it can also be classified according to the shape of the chip and the type of substrate of the chip. With the development of integrated circuit technology, the packaging requirements for chips have become more stringent.

All in all, the above is the relevant knowledge of chip packaging.

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