In today's society, many devices require the blessing of chips. Without the blessing of chips, there would be no such modern high-tech equipment. The chip packaging and testing technology is to first pass a batch of wafers through testing and then undergo special processing according to the functions required by the equipment and the model of the corresponding product, thereby obtaining independent chips to meet the needs of high-tech equipment. Therefore, chip packaging and testing technology plays a vital role in today's technological development. So what is chip packaging and testing? Let us take a look together!

  Chip packaging and testing technology can generally be divided into two stages. One is a series of operations performed before packaging and testing. We call these operations the front stage. The series of operations after forming are called the back stage. The chip packaging and testing technology combines the front-end and the back-end to form a complete chip packaging and testing process. Only then can the produced qualified wafers be turned into chips with specific functions and models through packaging and testing technology.

  The front end of packaging and testing technology mainly includes backside thinning, circular mirror cutting, optical inspection, and chip bonding. For round mirrors that have just been produced, they need to be thinned on the back to ensure that they reach the thickness of the package. When grinding the backside, pay attention to the protection of the circuit area, and generally adopt the measure of applying glue on the front side. Then, it goes through circular mirror cutting, light inspection, and chip bonding to detect whether there are any waste products in the product while preventing oxidation.

  The latter part of the packaging and testing technology includes injection molding, laser typing, high-temperature curing, overflow removal, electroplating and slicing to inspect waste products. The main purpose of injection molding is to protect the chip from external impact and use plastic sealing material to seal and test the product. Laser typing is to engrave some corresponding content on the product, such as the production date, batch, model and other chip-related information. High-temperature curing is to protect the internal structure of the IC, eliminate internal stress, and enhance the stability of the chip. Finally, electroplating is used to improve the conductivity and weldability of the product. Then the scrap can be inspected while slicing and forming. This series of operations is the chip packaging and testing technology required for the development of many high-tech equipment.

  All in all, the above is the chip packaging and testing technology.

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