The LQFP package is an integrated circuit package type that stands for Low Pin Count Quad Package. LQFP packages are commonly used to mount and package integrated circuit chips, especially chips with relatively low pin counts.

LQFP has four flat edges and pins are located on the bottom of the package, where the pins are arranged in a square or rectangular array, the number of which usually varies from 32 to more than 100. The size of the package can vary depending on the specific die size and application requirements.

LOFP packages are widely used in electronic equipment, especially in consumer electronics and communication equipment. Due to its small size and relatively low pin count, the LQFP package enables high integration and good thermal bonding performance. It also enables automated soldering and assembly via Surface Mount Technology (SMT), making the production process more efficient.

Package Features

The LQFP package has the following characteristics:

1. Small size: suitable for applications requiring high integration. The size usually ranges from a few millimeters to tens of millimeters, depending on the number of pins and package specifications. 2. Low latency: It can provide lower signal transmission delay. This is important for high speed signal transmission and response time sensitive applications

3. Good heat sealing performance: it has good heat sealing performance and can effectively transfer and disperse the heat generated by the chip. This helps prevent the chip from overheating and improves system stability and reliability.

4. Surface Mount Technology (SMT): Automated bonding and assembly using surface mount technology. This technology can improve production efficiency and reduce production costs

5. Moderate pin count: suitable for chips with relatively low pin count. The number of common LQFP package pins ranges from dozens to more than one hundred, and is suitable for integrated circuits of medium complexity.

6. Good reliability: Made of plastic material, it has good mechanical strength and corrosion resistance. It can provide a stable packaging environment and protect the chip from the external environment.

environmental interference.

Advantages and disadvantages

The advantages and disadvantages of LQFP package mainly include the following items

advantage:

1. Miniaturization: The package is relatively small, which can achieve high integration in a limited space, suitable for applications requiring compact size. 2. Lower cost: Compared with some advanced packages (such as BGA), the manufacturing cost of LQFP package is relatively low, which helps to reduce the overall product cost. 3. Good thermal bonding performance: Reasonable design helps to transmit and disperse the heat generated by the chip, improve the heat dissipation effect, and thus improve the stability and reliability of the system. 4. Easy to weld and repair: Using surface mount technology (SMT), automatic welding and assembly can be performed to simplify the production process. In addition, since the pins are more exposed, it is easy to repair and replace.

shortcoming:

1. The number of pins is limited: it is suitable for chips with a relatively low number of pins, and cannot meet the application requirements of complex circuits and large number of pins.

2. Signal transmission limitation: Due to the large number of package pins and the tight layout, the LQFP package may have certain limitations in high-frequency and high-speed signal transmission.

3. Limited reliability: Compared with some advanced packages (such as CSP or BGA), the reliability of LQFP package may be lower, and it is vulnerable to mechanical stress and environmental influence.

Eurotech is a worldwide supplier and exporter of electronic components, specializing in ICs, LCDs, Memory, Chips, computer parts, networking equipments and other passive components.

Tel: (86) 755 8395 9469

E-mail: info@eurotech-ic.com