Integrated circuit chips can usually be divided according to functional structure, manufacturing process, integration level, conductivity type, purpose and application field. According to the functional structure, it can be divided into three categories: analog integrated circuits, digital integrated circuits and digital/analog hybrid integrated circuits. According to the manufacturing process, it can be divided into semiconductor integrated circuits and film integrated circuits, and film integrated circuits are classified into thick film integrated circuits and thin film integrated circuits. According to the level of integration, it can be divided into: SSIC small-scale integrated circuit, MSIC medium-scale integrated circuit, LSIC large-scale integrated circuit, VLSIC very large-scale integrated circuit, ULSIC very large-scale integrated circuit and GSIC huge-scale integrated circuit, also known as VLSI or VLSI.

  According to the conductivity type, it can be divided into bipolar integrated circuits and unipolar integrated circuits, both of which are digital integrated circuits. The manufacturing process of bipolar integrated circuits is complex and consumes a lot of power. Representative integrated circuits include TTL, ECL, HTL, LST-TL, STTL and other types. The manufacturing process of unipolar integrated circuits is simple, the power consumption is low, and it is easy to make large-scale integrated circuits. The representative integrated circuits include CMOS, NMOS, PMOS and other types.

   According to the application, it can be divided into integrated circuits for televisions, integrated circuits for cameras, integrated circuits for languages, integrated circuits for electronic organs, integrated circuits for computers (microcomputers), integrated circuits for tape recorders, integrated circuits for alarms, integrated circuits for audio, and remote controls. Integrated circuits, DVD player integrated circuits, communication integrated circuits and various application-specific integrated circuits. Application fields can be divided into standard general integrated circuits and application specific integrated circuits. According to the shape, it can be divided into flat type (good stability, small size), round type (metal shell transistor package type, generally suitable for high power) and dual in-line type.