The production workshop of semiconductor chips has very strict control of production conditions, constant temperature, constant humidity, strict control of air dust particle size and strict electrostatic protection measures. Only under such strict environmental control can bare chips be will not fail. However, the surrounding environment we live in is completely impossible to have such conditions. The low temperature may be -40°C, the high temperature may be 60°C, and the humidity may reach 100%. If it is an automotive product, its operating temperature may be as high as 120 ^C above. At the same time, there will be various external impurities, static electricity and other problems that will invade the fragile chip. Therefore, packaging is needed to better protect the chip and create a good working environment for the chip.
2. Support
The support has two functions, one is to support the chip, fix the chip to facilitate the connection of the circuit, and the other is to form a certain shape to support the entire device after the packaging is completed, so that the entire device is not easily damaged.
3. Connection
The role of the connection is to connect the electrodes of the chip with the external circuit. The pins are used to communicate with external circuits, and the gold wires connect the pins to the circuit of the chip. The slide table is used to carry the chip, the epoxy resin adhesive is used to paste the chip on the slide table, the pins are used to support the whole device, and the plastic package is used for fixing and protecting.
4. Heat dissipation
Enhanced heat dissipation is to consider that all semiconductor products will generate heat when they are working, and when the heat reaches a certain limit, it will affect the normal operation of the chip. In fact, the various materials of the package itself can take away part of the heat. Of course, for most chips that generate a lot of heat, in addition to cooling through the package material, it is also necessary to consider installing an additional metal heat sink or fan on the chip. In order to achieve better cooling effect.
5. Reliability
Any package needs to form a certain reliability, which is the most important measure in the whole package process. The original chip will be damaged after leaving a specific living environment and needs to be packaged. The working life of the chip mainly depends on the choice of packaging materials and packaging technology.
