(1) Unpacked ICs and ICs in tubes must be stored in a drying cabinet, and the humidity in the drying cabinet should be <20% R.H;

(2) Humidity card check: the displayed value should be less than 20% (blue); if >30% (red), it means that the IC has absorbed moisture;

(3) Environmental temperature and humidity control in SMT workshop: operate at a temperature of 22°C (±4°C) and a humidity of 60%R.H (±20%);

(4) Immediately use it for SMT production after baking; or put in an appropriate amount of desiccant, then seal the package, and store it in a drying cabinet;

(5) After unpacking, the IC must complete the SMT welding procedure within 48 hours;

(6) Control the quantity of IC received: the quantity received each time should not exceed the quantity used for production;

(7) Unused IC components must be re-baked or dehumidified at room temperature in a drying cabinet to eliminate the moisture absorption problem of IC components.